Thermosetting resins, with their high adhesive and structural strength and thermal and chemical durability, are used in semiconductor devices, generators, transformers and switches, coils and other components for electric vehicles and hybrid electric vehicles, printed circuit boards, and MRIs.
However, they also present unique issues and problems in the production processes used to put the materials to use.

FLOW-3D ThermoSET is designed specifically to solve such complex problems, since it incorporates an empirical model for calculating viscosity changes associated with a chemical reaction and includes a non-dimensional relationship for time and viscosity.
FLOW-3D ThermoSET also contains a model for predicting deformation gold wires which was derived from a combination of empirical data and theoretical viscosity values for several semiconductor devices.

FLOW-3D ThermoSET can be used for the following applications:
    • resin-encapsulated devices such as semiconductors, memory devices, diode devices, electronic modules for automobiles, ignition parts, sensor parts and more, using the molding, potting, under filling, and die bonding processes.
    • encapsulation of motor coils, generator coils, MRI coils, and superconducting coils using molding and resin transfer molding.
    • heavy electrical transformers and circuit breaker
    • casks for storage and transport of radioactive used nuclear fuel
    • anisotropic conductive film and non-conductive film

FLOW-3D ThermoSET enables engineers to model the flow and thermal characteristics of thermosetting resins in fast, accurate simulations. Key advantages include:
    • fast and cost-effective data fitting for thermosetting resins
    • rasy meshing with structured gridding and FAVORTM
    • multiple mesh blocks for the best balance of speed and accuracy
    • model virtually all processes with FLOW-3D's highly accurate solver
    • prediction of gold wire deformation, void formation in filling, and other defects
    • output to structural analysis codes

FLOW-3D ThermoSET has been used in the electronics industry in Japan for over 5 years with great success, developed in cooperation with Hitachi and Terrabyte Corporation.